30 多年来,Qorvo 始终支持下一代国防和航空基础的创新。Qorvo 产品是许多世界上最先进的雷达、太空、通信和电子战 (EW) 系统的核心。创新产品,如 GaAs、GaN、SAW、BAW 以及集成式组装、定制芯片级封装和专家工程设计,帮助 Qorvo 满足全球任务关键性需求。我们携手美国国防部、DARPA 和研究实验室以及 Qorvo 自有的研发中心,为客户提供了显著的尺寸、重量和功率 (SWaP) 优势。

    Qorvo offers strategic customers additional services including integrated assembly, test and packaging, all in our secure facilities. We call this world-class facility "AMMA" — short for Advanced Microwave Module Assembly.

    • One-Stop Convenience: Fabricate circuits, package die and test components in one secure location for shorter lead times and greater savings.
    • Single- and Multi-Chip Assembly: Integrate single or multiple die using industry-standard or custom packages. Our packaged products benefit from the same innovative and dependable manufacturing process controls that ensure reliability and functionality for our MMIC device solutions.
    • Experience and Innovation: Ensure your program success through Qorvo’s expert teams and state-of-the-art facilities.
    • Die-on-Tab (DoT): Simplify assembly, increase yields and mitigate thermal considerations through virtually void-free vacuum reflow die attach. The DoT process attaches die-level devices to thermal spreaders for easier handling. All devices are 100% in-factory X-ray inspected.

    Contact your local sales person for details about our convenient, in-house integrated assembly and packaging services.

    Advanced Microwave Module Assembly (AMMA)Qorvo Advanced Microwave Module Assembly (AMMA) Facility
    Watch the Video

    Delivering Trusted Products That Meet Mission-Critical Needs

    Qorvo is proud to be a Category 1A "Trusted Source" supplier for the U.S. Department of Defense — providing the DoD and intelligence community with critical system microelectronics; foundry access for mission applications; and technology support through partnerships within the defense industrial base.

    Our accreditation:

      U.S. Dept. of Defense
    • Certifies that Qorvo products, processes and procedures meet the DoD’s stringent control and secure handling standards.
    • Expresses the confidence of the DoD Defense Microelectronics Activity (DMEA) and the National Security Agency's Trusted Access Program Office (TAPO) that Qorvo will continue to deliver trusted foundry goods and services that meet mission-critical needs now and into the future
    • Covers our GaAs, GaN and BAW technologies.

    Qorvo has led the industry as a trusted supplier and continues to add value with each renewal of the accreditation.

    Accreditation Milestones
    2008 Qorvo receives original "Trusted Source" Category 1A accreditation.
    2012 Renewal Accreditation adds post-processing, packaging/assembly and RF test services.
    2016 Renewal Accreditation expands to include design services.

    Manufacturing Readiness Level 9 for GaN

    In 2014 Qorvo was the first GaN RF chip manufacturer to achieve the U.S. Department of Defense’s MRL 9 – Manufacturing Readiness Level 9 – for its GaN technology. MRL 9 is the DoD’s second-highest level of production readiness and indicates that:

    • Our GaN manufacturing processes have met full performance, cost and capacity goals.
    • We have the capability in place to support full rate production of GaN technology.

    The DoD’s Manufacturing Readiness Assessment (MRA) ensures that manufacturing, production and quality assurance can meet operational mission needs for the U.S. military. This process ensures that the product or system transitions successfully from the factory to the field, providing the best value for the customer.

    As an established GaN provider for domestic and international defense programs, Qorvo continues to provide record-setting GaN circuit reliability and compact, high efficiency products, paving the way for robust performance, low maintenance and long operational lifetimes.

    Qorvo's patented Spatium® RF power combining technology provides a highly reliable, efficient alternative to traveling wave tube amplifiers (TWTAs). It delivers a higher standard of efficiency, reliability and bandwidth as well as clear size, weight, power and cost (SWaP-C) advantages.

    Target Applications